一、Features

Thisdatasheetspecifiestheoperationoftheunified LPDDR4 and LPDDR4X product, and first describes specific requirements for LPDDR4X 0.6V VDDQ operation. When using the product as an LPDDR4 device,refer to LPDDR4 setting section LPDDR4 1.10V VDDQ at the end of this data sheet.

• Ultra-low-voltage core and I/O power supplies；

• — VDD1 = 1.70–1.95V; 1.80V nominal；
• — VDD2 = 1.06–1.17V; 1.10V nominal；
• — VDDQ = 1.06–1.17V; 1.10V nominal or low VDDQ = 0.57–0.65V; 0.60V nominal；

• Frequency range；

• — 2133–10 MHz (data rate range: 4266–20 Mb/s per pin)；

• 16n prefetch DDR architecture；
• 8 internal banks per channel for concurrent operation；
• Single-data-rate CMD/ADRentry；
• Bidirectional/differential data strobe per byte lane；
• Programmable READ and WRITE latencies (RL/WL)；
• Programmable and on-the-fly burst lengths (BL = 16, 32)；
• Directed per-bank refresh for concurrent bank operation and ease of command scheduling；
• Up to 8.5 GB/s per die；
• On-chip temperature sensor to control self refresh rate；
• Partial-array self refresh (PASR)；
• Selectable output drive strength (DS)；
• Clock-stop capability；
• RoHS-compliant, “green”packaging；
• Programmable VSS (ODT) termination；
• Single-ended CK and DQS support；
• Improved tRFCab/tRFCpb = 280ns/140ns；
• AEC-Q100；